Multi-Functional Universal Heating: Support Android+IP series / Upgradable and expandable design / Safe and fast layered fit / No air gun soldering iron
Modular Design: A variety of combined modules, common modules on the base, good scalability, easy-to-expand new modules
Support Android + IP: The heating area is large, the compatibility is good, and it supports the desoldering operation of various motherboard components, which is more convenient and quick
Intelligent Digital Display, Fast Heating: Intelligent temperature control, customized temperature adjustment according to different melting points, with fast heating, long life, and uniform temperature
360° Rotating Buckle Rail Design: 360° rotating buckle + guide rail design, suitable for precise clamping of motherboards of different shapes, improving maintenance efficiency
Precise Positioning: The module is equipped with a positioning column, which can be accurately separated and attached to the main board, and is easy to take
Heat Dissipation and Anti-Slip Design: Hollow heat dissipation design, high-temperature resistance; Silicone wear-resistant foot pads, stable operation, good anti-skid effect