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1 Bottle Tin BGA Reballing Solder Balls for BGA Rework Repair Tools - Diameter: 0.35mm
1 Bottle Tin BGA Reballing Solder Balls for BGA Rework Repair Tools - Diameter: 0.35mm

Product Descriptions

Specifications

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Product Descriptions

1 Bottle Tin BGA Reballing Solder Balls for BGA Rework Repair Tools - Diameter: 0.35mm
  • Brand new and high quality

  • Solder tin paste is the best choice of reballing IC 

  • It is used instead of the pin in the IC component package structure

Specification:

  • Brand: BEST

  • Model: 505

  • Material: tin

  • Diameter: 0.2mm~0.65mm 

  • Flux content: 63%

  • Melting point: 183°C

  • Working temperature: 200-380°C

  • Quantity: 25,000pcs per bottle

  • Balls alloy: Sn63/Pb37

  • Size: 35x16mm

Package included:

  • 1 x 1 Bottle Tin BGA Reballing Soldering Balls

Specifications

1 Bottle Tin BGA Reballing Solder Balls for BGA Rework Repair Tools - Diameter: 0.35mm

Item No.:  231401329E
Same model in different colors:
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