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1 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Repair Tools - Diameter: 0.3mm

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Item No.: 231401329D Ships in 1 - 3 days MOQ: 1
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Specifications

ColorStyle D
Retail Packaging No Package
User Manual (Language) No User Manual
Gross Weight 0.017kg
Volume Weight 0.002kg
Length 3.500cm
Width 1.600cm
Height 1.600cm
Weight 0.015kg
With Retail Packaging Yes

Product Description

1 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Repair Tools - Diameter: 0.3mm
  • Brand new and high quality

  • Solder tin paste is the best choice of reballing IC 

  • It is used instead of the pin in the IC component package structure

Specification:

  • Brand: BEST

  • Model: 505

  • Material: tin

  • Diameter: 0.2mm~0.65mm 

  • Flux content: 63%

  • Melting point: 183°C

  • Working temperature: 200-380°C

  • Quantity: 25,000pcs per bottle

  • Balls alloy: Sn63/Pb37

  • Size: 35x16mm

Package included:

  • 1 x 1 Bottle Tin BGA Reballing Soldering Balls
1 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Repair Tools - Diameter: 0.3mm-1 1 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Repair Tools - Diameter: 0.3mm-2
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