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BST-1023A 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone X
BST-1023A 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone X
BST-1023A 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone X
BST-1023A 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone X
BST-1023A 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone X
BST-1023A 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone X
BST-1023A 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone X

Product Descriptions

Specifications

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Product Descriptions

BST-1023A 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone X
  • Made by high quality steel material

  • The stepped grooves can quickly adjust the tin sweating location of IC beads

  • Easy and quickly for reballing the BGA IC

  • Excellent to replace IC or BGA rework reballing

Package included:

  • 1 x BST-1023A 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template

Specifications

BST-1023A 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone X

Item No.:  090602561A
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