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BST-iPH-4 IC Chip BGA Reballing Stencil Solder Template for iPhone X/8P/8-A11

Product Descriptions

Specifications

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Product Descriptions

BST-iPH-4 IC Chip BGA Reballing Stencil Solder Template for iPhone X/8P/8-A11
  • Made by high quality metal material

  • Easy and quickly for reballing the BGA IC

  • Excellent to replace IC or BGA rework reballing

Package included:

  • 1 x BST-iPH-4 IC Chip BGA Reballing Stencil Solder Template for iPhone X/8P/8-A11

Specifications

BST-iPH-4 IC Chip BGA Reballing Stencil Solder Template for iPhone X/8P/8-A11

Item No.:  090602550A
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