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Bumblebee Stencils IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6S Plus
Bumblebee Stencils IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6S Plus

Product Descriptions

Specifications

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Product Descriptions

Bumblebee Stencils IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6S Plus
  • Imported alloy steel, high-temperature resistant and wear-resistant

  • Designed specifically for mobile phone chips, it can make each solder ball round and full, meeting the needs of tin planting for various chips

  • Easy and quickly for reballing the BGA IC

  • Excellent to replace IC or BGA rework reballing

Compatible with:

  • iPhone 6S/6S Plus

Package included:

  • 1 x Reballing Stencil

Specifications

Bumblebee Stencils IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6S Plus

Item No.:  661600112A
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