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MagicPad Multi-functional Positioning Presssure-reducing Protective Pad for BGA CPU IC Reballing
MagicPad Multi-functional Positioning Presssure-reducing Protective Pad for BGA CPU IC Reballing
MagicPad Multi-functional Positioning Presssure-reducing Protective Pad for BGA CPU IC Reballing
MagicPad Multi-functional Positioning Presssure-reducing Protective Pad for BGA CPU IC Reballing
MagicPad Multi-functional Positioning Presssure-reducing Protective Pad for BGA CPU IC Reballing
MagicPad Multi-functional Positioning Presssure-reducing Protective Pad for BGA CPU IC Reballing
661600241A

Product Descriptions

Specifications

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Product Descriptions

MagicPad Multi-functional Positioning Presssure-reducing Protective Pad for BGA CPU IC Reballing
  • Specially designed for repairing BGA chips of electronic products

  • Effectively avoid tin messing caused by the deformation of steel mesh

  • Replace the iPhone front camera and infrared camera cable. It is a safer fixture to avoid camera blurring caused by heating

  • Fixed iPhone fingerprints and dot-matrix flex cable (not included)

  • Soft material, durable to use

Package included:

  • 1 x Protective Pad

Specifications

MagicPad Multi-functional Positioning Presssure-reducing Protective Pad for BGA CPU IC Reballing

Item No.:  661600241A
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