High precision air and heat control for welding and removing with security and reliability
Suitable for desoldering various kinds of components such as SOIC, CHIP, QFP, PLCC, BGA etc.
Can be used for heat shrinkage, drying, paint and sticker removal, preheating, glue connecting etc.
Specification:
Airflow: 24L/min(max)
Outer dimension: 185x125x245mm
Power: 320W
Temperature: 150°C~500°C