RELIFE RL-601MA A8-A15 CPU Reballing Stencil Platform for iPhone 6-13 Pro Max IC Chip Planting Tin Template Fixture
Using a new type of magnetic power original positioning, strong magnetic automatic camping convenient and flexible, support for a variety of CPU maintenance positioning, stable and reliable clamping
Various models, suitable for A8 / A9 / A10 / A11 / A12 / A13 / A14 / A15
Built-in high-temperature magnet, strong magnetic adsorption, precise positioning, no offset, high-temperature magnetic unchanged
General more IC clamps such as chip CPU/hard disk/font library; place the chip fixedly in the upper left corner of the chip slot (let the magnetic suction module automatically withstand the edge of the chip, which can cover the corresponding chip tin-planting steel stencil)
Specifications:
Brand: RELIFE
Product: CPU Reballing Stencil Platform
Model: RL-601MA
Net weight: about 130g
Gross weight: 150g
Size: 55*70*14mm
Steel Stencil Thickness: 0.12mm
Note: Manual measurement will have ± tolerance, for reference only, please refer to the actual product.
Package included:
1 x Fixture
8 x Steel Mesh
Specifications
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RELIFE RL-601MA A8-A15 CPU Reballing Stencil Platform for iPhone 6-13 Pro Max IC Chip Planting Tin Template Fixture
Item No.: Â 661600618A
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