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S1016 11 in 1 Phone Mainboard BGA CPU Chip Repair Remove Tool Ultra Thin Blade Set

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Item No.: 231401077A Ships in 1 - 3 days MOQ: 1
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Specifications

Retail Packaging Plastic Box
Gross Weight 0.064kg
Volume Weight 0.047kg
Length 17.000cm
Width 9.500cm
Height 1.300cm
Weight 0.057kg
With Retail Packaging Yes

Product Description

S1016 11 in 1 Phone Mainboard BGA CPU Chip Repair Remove Tool Ultra Thin Blade Set
  • Set includes one handle and 10 blades 

  • Can be used for remove IC Chip CPU BGA on smart phone mainboard, PCB repair, etc.

  • With the scale on blades design, convenient to use

Specification:

  • TS016 handle, 139.7x11.4mm

  • MCN-A blade, remove phone IC/CPU/Baseband, 33x6mm

  • MCN-B blade, shovel glue/bonding pad, 34x6mm

  • MCN-C blade, CPU/shovel glue/bonding pad, 29x6mm

  • MCN-D blade, CPU/shovel glue/bonding pad, 26x6mm

  • MCN-E blade, shovel glue, 34x6mm

  • MCN-F blade, remove glue on marginal place (IC), 24.5x6mm

  • MCN-G blade, remove IC on motherboard, 28x6mm

  • MCN-H blade, remove IC, 29x6mm

  • MCN-I blade, remove 6S power IC, 22x6mm

  • MCN-J blade, remove glue on marginal place (IC), 27.5x6mm

Package included:

  • 1 x S1016 11 in 1 Phone Mainboard BGA CPU Chip Repair Remove Tool Ultra Thin Blade Set
S1016 11 in 1 Phone Mainboard BGA CPU Chip Repair Remove Tool Ultra Thin Blade Set-1 S1016 11 in 1 Phone Mainboard BGA CPU Chip Repair Remove Tool Ultra Thin Blade Set-2 S1016 11 in 1 Phone Mainboard BGA CPU Chip Repair Remove Tool Ultra Thin Blade Set-3 S1016 11 in 1 Phone Mainboard BGA CPU Chip Repair Remove Tool Ultra Thin Blade Set-4 S1016 11 in 1 Phone Mainboard BGA CPU Chip Repair Remove Tool Ultra Thin Blade Set-5 S1016 11 in 1 Phone Mainboard BGA CPU Chip Repair Remove Tool Ultra Thin Blade Set-6 S1016 11 in 1 Phone Mainboard BGA CPU Chip Repair Remove Tool Ultra Thin Blade Set-7
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